Our bare Cu wires (BX series) are characterized by longer floor life and higher bondability compared with conventional bare Cu wire. They are available in various diameters from fine diameters for general purposes to very thick diameters for power device application.
BX1 achieves higher 2nd bond strength and longer floor life (10 days guarantee after opening the sealed bag) than conventional bare Cu wire.
BX2 is an alloyed Cu wire with low electrical resistivity (2.0μΩcm). while maintaining all the benefits of BX1, BX2 achieves improved bonded ball shape and long-term reliability.
|2nd pull force
|Bonded ball shape
|Long term reliability