One of the typical uses of micro ball is to make an electrical connect between semiconductor package and circuit board. Our micro balls have superior fatigue resistance and mountability and are suitable for various packages from BGA and CSP to flip chip.
LF60 is an AuSn micro ball with a high melting point of 278°C, making it suitable for high temperature applications.
LF35 is a standard lead-free micro ball with low Ag content with excellent drop performance.
LF45 is a standard lead-free micro ball.
|Au80 / Sn20
|Sn / Ag1.2 / Cu0.5 / Ni0.05
|Sn / Ag3.0 / Cu0.5
LF35 is developed for mobile electronic applications and has an excellent drop performance of surface mount electronic components.