Providing essential materials for the evolution of
Welcome to our bonding wire product page. We provide high quality products meeting with each customer’s need.
Seven reasons for choosing us
Nippon Micrometal has been developing new materials for semiconductor industry with a challenging spirit always in its heart. We have succeeded in the mass production of palladium coated copper wire for the first time in the world and realized the replacement from gold wire. As for micro ball, we started its production in 1997 and built a solid record since then. We have been responding quickly and flexibly to the needs of rapidly evolving semiconductor industry.