Sustainability Carbon Footprint

CFP for Bonding Wire

Scope of CFP Study for Bonding Wire Manufacturers in the Life Cycle

Boundaries and Scenarios for Quantification

CFP of Au Bonding Wire and Au/Pd Coated Cu Bonding Wire (EX1p) are quantified and compared under conditions below.

・Product unit:

Bonding wire which have diameter of 20 um, and length of 1000m

・Uptream(Material Procurement):

Metal raw materials (including coating materials for EX1p) are determined for scope of quantification. IDEA Database is referred for the quantification.

・Our company(Production):

Electricity consumption for the production of Au Wire and EX1p is assumed equivalent.

Quantification result: GHG emission of Au/Pd Coated Cu Wire (EX1p) is less than Au Wire.

Nippon Micrometal has developed and commercialized Pd Coated Cu Wire and Au/Pd Coated Cu Wire.
We could contribute to reduce the environmental impact by promoting the replacement of Au wire with Pd Coated Cu Wire and Au/Pd Coated Cu Wire.