Products
Bonding wire
GX（Ag bonding wire）
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GX2 series an innovative Ag alloy wire that achieves excellent long-term reliability and low electrical resistivity simultaneously. It has a comparable bondability and soft FAB as in Au wire, thus applicable to weak pad structure. It is well suited for various applications from stacked memory, LED, and to high reliability automotive packages. GX2 series realizes an attractive cost reduction from conventional Au wire.
Product lineup
GX2
GX2 has an excellent humidity resistance. Its electrical resistivity is comparable to 4N Au wire. With the bondability and looping performance equivalent to Au wire, GX2 is ideal for stacked memory device as an alternative to Au wire.
GX2s
GX2s has excellent humidity resistance and high temperature resistance, exceeding the requirements for AEC-Q006 Grade 0. Bonding performance is comparable to GX2.
| ※1 | AEC-Q006 Grade 0：Qualification requirements for components using Cu wire interconnect defined by Automotive Electronics Council. |
GX2s: key features
| Item | GX2s | Au wire |
|---|---|---|
| Purity | 98% | 99.99% |
| Resistivity(RT) | 2.4μΩcm | 2.4μΩcm |
| Loop performance | Same/better | - |
| FAB hardness | 41Hv | 43Hv |
GX2s: long term reliability
