Products
Bonding wire
EX（Pd coated Cu bonding wire）
■ Products
EX wire is a de facto standard Pd coated Cu (PCC) wire in world-wide market with attractive cost saving and stable productivity. We are the world leading company of PCC wire and developing a wide range of product lineups to meet the various market needs.
Product lineup
EX1
EX1 is the 1st generation of EX series. It realized a significant cost reduction as an alternative to Au wire and changed the dynamics of bonding wire market. Compared with bare Cu wire, bondability, floor life and long-term reliability are significantly improved.
EX1p
EX1p is the current standard of EX series. It is an Au/Pd coated Cu wire with Au flash on top of Pd coating. Compared with EX1, stitch bond performance is improved. Furthermore, Pd distribution on FAB (Free Air Ball) is also improved.
EX1F
Humidity resistance is substantially improved from EX1p. EX1F has a comparable bondability as EX1p and can be bonded with the same parameters.
EX1R
Both humidity resistance and high temperature resistance are improved from EX1p. EX1R is designed to surpass the AEC-Q006 Grade 0 (※1) requirements, thus suitable for automotive applications with high reliability requirements. The bondability is comparable to EX1p.
EX1S
By introducing a new coating technology, EX1S realized a high corrosion resistance and low resistivity simultaneously. Just like EX1R, EX1S surpasses the AEC-Q006 Grade 0 requirements. The bondability is comparable to EX1p.
| ※1 | AEC-Q006 Grade 0：Qualification requirements for components using Cu wire interconnect defined by Automotive Electronics Council. |
EX series: key features
| Item | Product | |||||
|---|---|---|---|---|---|---|
| EX1S | EX1R | EX1F | EX1p | EX1 | ||
| Cu purity | 2N | 2N | 2N | 4N | 4N | |
| Pd distribution on FAB | ◎ | ◎ | ◎ | ○ | △ | |
| 2nd bondability | ◎ | ◎ | ◎ | ◎ | ○ | |
| Reliability | High humidity | ◎ | ◎ | ◎ | ○ | △ |
| High temp (Grade 1) | ◎ | ◎ | ◎ | ○ | △ | |
| High temp (Grade 0) | ◎ | ◎ | ー | ー | ー | |
| Spooled length | 〜5000m | |||||
| Floor life | 30days | |||||
EX series developing map
- HAST：
- Highly Accelerated temperature & humidity Stress Test
- HTSL：
- High Temperature Storage Life test
EX1p φ16μm
Uniform Pd coverage
EDS Pd mapping of bonded ball