NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.
Product information
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Bonding wire is materials with Connectivity for semiconductor packaging conveys electrical signals to the outside of the semiconductor device.
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 As an alternative to expensive Au wire, Ag wire realizes an attractive cost saving for a semiconductorpackaging company.
 Item | GX2 | Conventional Ag wire |
Resistivity | â—Ž | â–³ |
HAST Reliability | ◎ | 〇 |
Leaning Property | â—Ž | â—Ž |
Snaking Property | â—Ž | â—Ž |
Pad Damage/Metal Peeling | â—Ž | â—Ž |
Stitch Strength | â—Ž | â—Ž |
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