NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.

Product information

New Generation Ag Wire GX



Bonding wire is materials with Connectivity for semiconductor packaging conveys electrical signals to the outside of the semiconductor device.

 As an alternative to expensive Au wire, Ag wire realizes an attractive cost saving for a semiconductorpackaging company.

Conventional Ag wire had problems in electrical property and long term bond reliability.
GX2 has cleared these problems and realized low electrical resistivity and high long term bond reliability.
It has been used for 3D memory device and is possible to apply in next generation high speed devices.
 Item GX2 Conventional Ag wire
HAST Reliability
Leaning Property
Snaking Property
Pad Damage/Metal Peeling
Stitch Strength

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